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[Research] Examination of Copper Etching on Substrates in Lead-Free Solder Reflow

Published results of the investigation into the changes in copper thickness of the substrate during lead-free solder reflow processing.

This document presents the experimental methods and results of investigating the changes in copper thickness of substrates during lead-free solder leveling processing. During lead-free solder leveling, a phenomenon known as "copper eating" can be observed, which affects the copper thickness of the substrate. We conducted measurements to determine how much lead-free solder increases compared to eutectic solder by varying conditions such as temperature. While it cannot be said that this applies universally to all substrates, we hope it can serve as a guideline. 【Contents】 ■ Purpose ■ Experimental Methods ■ Experimental Results ■ Discussion ■ Summary ■ Future Challenges *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • Handa Rebera

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Proposed with fully customized design! (System Integration)

We will bring to life the idea of 'I wish there were such a machine.' For manufacturing companies' production lines!

Our company offers fully customized products designed and manufactured one by one based on customer hearings. We can handle the entire process from listening to your requests to the final product realization in-house. Whether it’s labor-saving machines, assembly machines, control devices, or any other type of product, we accurately capture your needs, prepare suitable plans, and deliver products with assured quality. Business Activities ■ Mechanical design, electrical design, manufacturing, modification, and sales of related consumables.

  • Contract manufacturing
  • Handa Rebera

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Introduction to Basic Knowledge: "Handa Leveler"

Short processing time and inexpensive compared to other plating. Good wettability of solder during assembly.

The "Handa Leveler" is designed to apply a solder coat on the copper surface that forms the land area of printed circuit boards, with the aim of enhancing surface protection and wettability during assembly. The board is immersed in molten solder, and when it is pulled up, high-temperature air is blown from an air knife located above the solder tank to remove excess solder from the board holes, pad surfaces, and resist. This process ensures that only the copper surface is coated with solder. 【Features】 ■ Short processing time allows for high processing capacity ■ Relatively inexpensive ■ Good wettability of solder during assembly ■ High storage stability ■ Reworkable *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Other electronic parts
  • Handa Rebera

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Repair and improvement services for mechanical devices *Case studies available for problem-solving

We possess both electrical control and mechanical design technologies, and we handle repairs for manufacturing machinery in various fields, including precision equipment and medical devices!

I provided specific examples related to machine repairs. There are common issues such as the company that manufactured the machine going bankrupt or electrical controls being outsourced and not connected. I have listed solutions to these common problems categorized by cost. This time, I picked up three cases: 1. Repairs in the 10,000 yen range 2. Repairs in the 500,000 yen range 3. Repairs in the 2,000,000 yen range I could only introduce these three this time, but we handle many other repairs as well. *For more details, please refer to the PDF document or feel free to contact us.*

  • others
  • Handa Rebera

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